The core processor chip PHY6252 (SSOP24) of this module is a BLE SoC with high integration and low power consumption, which is specially designed for various applications such as IoT, mobile devices, wearable electronic devices and smart homes. PHY6252 (SSOP24) chip has industry-leading low power consumption performance and RF performance, it supports BLE 5.2. The chip built in 64 KB SRAM, 256KB flash, 96 KBROM, 256bit efuse. The chip supports a variety of low-power working states and can meet the power consumption requirements of various application scenarios. RF output power can be adjusted to achieve the best balance among communication distance, communication rate and power consumption. PB-03F module provide rich peripheral interfaces, including UART, PWM, ADC, I2C, SPI, PDM, DMA and up to 19 IOs. PB-03F module has many unique hardware security mechanisms. Hardware encryption accelerator supports AES algorithm. PB-03F module supports BLE with low power consumption: BLE 5.2 and BLE mesh Bluetooth rate supprt: 125Kbps, 500Kbps, 1Mbps, 2Mbps. Support broadcast expansion, multi-broadcast, channel selection.

Features:

• Support BLE 5.2, rate support: 125Kbps, 500Kbps, 1Mbps, 2Mbps
• Own 64 KB SRAM,256KB flash, 96 KB ROM,256bit efuse
• Support UART/GPIO/ADC/PWM/I2C/SPI/PDM/DMA interface
• Adopt SMD-22 package
• Support multiple sleep modes, deep sleep current is less than 1uA
• Support for serial local upgrade and remote Firmware upgrade(FOTA)
• Universal AT instructions can be used easy and quickly
• Support for secondary development, with an integrated Windows development environment

Specifications:

• Model: PB-03F
• Package: SMD-22
• Size: 24.0*16.0*3.1(0.2)mm
• Antenna: On-board antenna
• Frequency: 2400 ~ 2483.5MHz
• Operating Temperature: -40C ~ 85C
• Storage Temperature: -40C ~ 125C, <90%RH
• Power Supply: Voltage 2.7V ~ 3.6V, Current >200mA
• Interface: UART/GPIO/ADC/PWM/I2C/I2S/SPI/PDM/DMAIO 19
• UART rate: Default 115200 bps
• Bluetooth: BLE 5.2
• Security: AES-128
• SPI Flash: 256KB